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Technical parameters

Key specs

Positions12
Power
Rated current19 A
Rated impulse voltage1.5 kV
Rated voltage180 V
Test voltage Ur.m.s.0.84 kV
Environment and package
China RoHSe
Limiting temperature-55 ... +125 °C
Moisture Sensitivity Level (MSL)1 acc. to ECA/IPC/JEDEC J-STD-020D
Packaging size1
REACH ANNEX XIV substancesNot contained
REACH Annex XVII substancesNot contained
REACH SVHC substancesNot contained
RoHScompliant
Other
California Proposition 65 substancesNot contained
CategoryConnectors
Clearance distance≥0.94 mm
Colour (insert)Black
Connection typeMotherboard to daughtercard
Contact resistance25 mΩ
Contact spacing (mating side)2.54 mm
Contact spacing (termination side)2.54 mm
Coplanarity of contacts0.1 mm
Country of originChina
Creepage distance≥0.94 mm PCB
Description of the contactAngled
DetailsAccording to IEC 61984, it is an unencapsulated connector. Protection against electric shock must be ensured by the type of installation by the user.
eCl@ss27460201 PCB connector (board connector)
ElementFemale connector
ELV statuscompliant
ETIMEC002637
European customs tariff number85366990
FeaturesTermination method of hold downs: SMT
GTIN5713140204690
IdentificationPower
Insulation resistance>10 10 Ω
Isolation groupIIIa (175 ≤ CTI < 400)
Material (contacts)Copper alloy
Material flammability class acc. to UL 94V-0
Material (insert)Liquid crystal polymer (LCP)
Mating cycles500
Net weight2.4 g
Number of contacts12
Pack contentsSample
Performance level1
Pollution degree2
Process Sensitivity Level (PSL)R0 acc. to ECA/IPC/JEDEC J-STD-020D
Serieshar-flex®
Surface (contacts)Noble metal over Ni Mating side
Termination methodReflow soldering termination (THR)
UL / CSAUL 1977 ECBT2.E102079
UNSPSC 24.039121415

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