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Technical parameters

Environment and package
PackageBulk
Package AcceptedSOIC, TSSOP
Size / Dimension1.400" L x 0.700" W (35.56mm x 17.78mm)
Other
Board Thickness-
Material-
MfrAdafruit Industries LLC
Number of Positions28
Pitch-
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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