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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Composition | Sn99.3Cu0.7 (99.3/0.7) |
| Diameter | 0.048" (1.22mm) |
| Digi-Key Storage | - |
| Flux Type | Rosin Activated (RA) |
| Form | Spool |
| Melting Point | 440°F (227°C) |
| Mesh Type | - |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Obsolete |
| Series | Loctite® C 511 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Wire Gauge | - |
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