WIO LINK BOOTCAMP KIT W/GROVE
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Other | |
| Included MCU/MPU Board(s) | Wio Link |
| Interconnect System | Grove |
| Kit Type | Starter Kit |
| Main Purpose | IoT Kit |
| Mfr | Seeed Technology Co., Ltd |
| Product Status | Obsolete |
| Series | Wio |
| Suggested Programming Environment | Wio Link App |
| Utilized IC / Part | ESP8266 |
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