TE ConnectivitySwitzerland
CONN RCPT 50POS 0.05 GOLD SMD
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View full reportTechnical parameters
Key specs
Positions50
Rows2
Pitch1.27 mm
GenderFemale
| Power | |
|---|---|
| Current Rating (Amps) | - |
| Voltage Rating | - |
| Environment and package | |
| Insulation Height | 0.187" (4.75mm) |
| Mated Stacking Heights | 6.35mm, 8.13mm, 9.91mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -65°C~105°C |
| Package | Tube |
| Other | |
| Applications | - |
| Base Product Number | 104652 |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Finish Thickness - Post | 150.0µin (3.81µm) |
| Contact Length - Post | - |
| Contact Material | Copper Alloy |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Features | Board Lock |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | - |
| Mfr | TE Connectivity AMP Connectors |
| Number of Positions | 50 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Pitch - Mating | 0.050" (1.27mm) |
| Product Status | Active |
| Row Spacing - Mating | 0.050" (1.27mm) |
| Series | AMPMODU 50/50 Grid |
| Style | Board to Board or Cable |
| Termination | Solder |