Laird Technologies EMIUnited States
RFI FINGERSTOCK BECU TIN ADH
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Height | 0.070" (1.78mm) |
| Operating Temperature | 121°C |
| Storage/Refrigeration Temperature | 50°F ~ 77°F (10°C ~ 25°C) |
| Other | |
| Attachment Method | Adhesive |
| Length | 23.976" (609.00mm) |
| Manufacturer | Laird Technologies EMI |
| Material | Beryllium Copper |
| Packaging | Bulk |
| Part Status | Active |
| Plating | Tin |
| Plating - Thickness | 299.99µin (7.62µm) |
| Series | Twist |
| Shape | - |
| Shelf Life | 12 Months |
| Shelf Life Start | - |
| Type | Fingerstock |
| Width | 0.300" (7.62mm) |