搜索结果:CC2651P3
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- 有数据手册3
- 涉及品牌1
产品搜索结果共 3 条
| 对比 | 产品型号 | 品牌 | 分类 | 产品描述 | 技术资料 | 替代 | 操作 |
|---|---|---|---|---|---|---|---|
| 微控制器、微处理器及片上系统 | The SimpleLink™ CC2651P3 device is a single-protocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee , Bluetooth 5.2 Low Energy , IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651P3 is based on an Arm ® Cortex ® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure , building automation , retail automation , personal electronics and medical applications . The CC2651P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651P3 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBm TX at 101 mA (7x7 package). CC2651P3 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY. The CC2651P3 has a low sleep current of 0.8 µA with RTC and 32KB RAM retention. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply. The CC2651P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty , Sub-1 GHz MCUs, and host MCUs. CC2651P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity . | 数据手册3 | 查看详情 | ||||
| RF 收发器 IC | SIMPLELINK 32-BIT ARM CORTEX-M4 | 数据手册1 | 查看详情 | ||||
| RF 收发器 IC | SIMPLELINK 32-BIT ARM CORTEX-M4 | 数据手册1 | 查看详情 |
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