针数130
排数2
间距500 µm
公母母
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针数130
排数2
间距500 µm
公母母
| 环境与封装 | |
|---|---|
| Height Above Board | 0.234" (5.95mm) |
| Mated Stacking Heights | 15mm, 20mm, 30mm, 32mm, 33mm, 38mm, 40mm, 41mm |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR) |
| 其他 | |
| Base Product Number | XG1-130S |
| Connector Type | Receptacle, Center Strip Contacts |
| Contact Finish | Gold-Palladium |
| Contact Finish Thickness | 1.18µin (0.030µm) |
| Features | Board Guide, Solder Retention |
| Mfr | Hirose Electric Co Ltd |
| Number of Positions | 130 |
| Number of Rows | 2 |
| Pitch | 0.020" (0.50mm) |
| Product Status | Obsolete |
| Series | XG1 |
技术资料
该型号暂未收录资料。