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| 环境与封装 | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 68°F~77°F(20°C~25°C) |
| 其他 | |
| Base Product Number | TS391S |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Flux Type | No-Clean |
| Form | Jar, 1.76 oz (50g) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Mesh Type | 4 |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Wire Gauge | - |