TS391LT500C

在产焊料

THERMALLY STABLE SOLDER PASTE NO

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技术参数

环境与封装
PackageBulk
Storage/Refrigeration Temperature68°F~77°F(20°C~25°C)
其他
Base Product NumberTS391L
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter-
Flux TypeNo-Clean
FormCartridge, 17.64 oz (500g)
Melting Point281°F (138°C)
Mesh Type4
MfrChip Quik Inc.
ProcessLead Free
Product StatusActive
Series-
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Shipping Info-
TypeSolder Paste
Wire Gauge-

技术资料