SBBTH3050-1

在产原型板有孔

LG SOLDER-IN BREADBOARD 1500 PLA

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技术参数

环境与封装
PackageBulk
Size / Dimension5.10" L x 3.20" W (129.5mm x 81.3mm)
其他
Base Product NumberSBBTH
Board Thickness0.063" (1.60mm)
Circuit PatternPad Per Hole (Round)
Edge Contacts-
Hole Diameter0.039" (1.00mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Pitch0.1" (2.54mm) Grid
PlatingPlated Through Hole (PTH)
Product StatusActive
Proto Board TypeBreadboard, General Purpose
SeriesProto-Advantage

技术资料

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