SBB830-QTY25

在产原型板有孔

830 PTS SOLDER-IN BREADBOARD (EX

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技术参数

环境与封装
PackageBulk
Size / Dimension6.60" L x 2.30" W (167.6mm x 58.4mm)
其他
Board Thickness0.063" (1.60mm)
Circuit Pattern5 Hole Pad (Single Side)
Edge Contacts-
Hole Diameter0.039" (1.00mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Pitch0.1" (2.54mm) Grid
PlatingPlated Through Hole (PTH)
Product StatusActive
Proto Board TypeBreadboard, General Purpose
SeriesProto-Advantage

技术资料

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