RAS-HS-C

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HEATSINK RASPBERRY PI ALUM/COP

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技术参数

环境与封装
Fin Height-
PackageRetail Package
Package CooledRaspberry Pi 2B, 3B, 3B+, 4B, B+
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
其他
Attachment MethodThermal Tape, Adhesive (Included)
Base Product NumberRAS-HS
Diameter-
Length-
MaterialAluminum, Copper
Material Finish-
MfrMicro Connectors, Inc.
Product StatusActive
Series-
ShapeRectangular, Fins; Square, Fins
Shelf Life-
TypeTop Mount Kit
Width-

技术资料

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