I-PEX日本
Fully-shielded, 1.2 mm mated height, 0.35 mm pitch, power contact-equipped, up to 40 Gbps per lane supporting board-to-board connector
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| 电源 | |
|---|---|
| Current Rating | Signal: 0.3 A/pinPower: 4.5 A/pin x 4 |
| 环境与封装 | |
| Mated Height | 1.2 +/- 0.05 mm |
| Operating Temperature | -40 to 85℃ (233 to 358 K) |
| 其他 | |
| Applicable Standards (Reference Only) | USB4 (20 Gbps/lane)USB3.1 Gen2 (10 Gbps/lane)eDP HBR3 (8.1 Gbps/lane)eDP HBR2 (5.4 Gbps/lane)HDMI 2.1 (12 Gbps/lane)V-By-One HS 1.4 (4 Gbps/lane)MiPi standards |
| Available Pin Count | Signal+Power: 22+4, 56+4, 62+4 |
| Contact Pitch | 0.35 mm |
| Depth | 3.7 mm |
| Full EMI Shielding (ZenShield®) | Yes |
| Product Type | Board-to-Board |
| Transmission Speed (Reference Only) | 40 Gbps/lane NRZ |
| Width | 4.86 + (0.35 x pin count/2) mm |
器件图片
技术资料
数据手册数据手册 · 3.5 MB · 2026-09-24数据手册数据手册 · 418.1 KB · 2026-09-24封装图纸封装图纸 · 2.4 MB · 2026-09-24模型图档模型图档 · 1.8 MB · 2026-09-24模型图档模型图档 · 1.7 MB · 2026-09-24封装图纸封装图纸 · 1.6 MB · 2026-09-24模型图档模型图档 · 1.5 MB · 2026-09-24模型图档模型图档 · 1.4 MB · 2026-09-24封装图纸封装图纸 · 1.2 MB · 2026-09-24用户手册用户手册 · 1.2 MB · 2026-09-24模型图档模型图档 · 1.1 MB · 2026-09-24模型图档模型图档 · 821.4 KB · 2026-09-24选型与目录选型与目录 · 733.9 KB · 2026-09-24封装图纸封装图纸 · 535.7 KB · 2026-09-24封装图纸封装图纸 · 521.4 KB · 2026-09-24其他资料其他资料 · 421.9 KB · 2026-09-24环保合规环保合规 · 147.1 KB · 2026-09-24其他资料其他资料 · 107.6 KB · 2026-09-24环保合规环保合规 · 107.2 KB · 2026-09-24
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