I-PEX日本
Fully-shielded, 1.5 mm mated height, 0.35 mm pitch, up to 40 Gbps per lane supporting board-to-board connector
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| 电源 | |
|---|---|
| Current Rating | Signal: 0.5 A/pin (12.0 A max. (Total)) |
| 环境与封装 | |
| Mated Height | 1.5 +/- 0.1 mm |
| Operating Temperature | -40 to 85℃ (233 to 358 K) |
| 其他 | |
| Applicable Standards (Reference Only) | USB4 (20 Gbps/lane)USB 3.1 Gen 2 (10 Gbps/lane)eDP HBR 3 (8.1 Gbps/lane)eDP HBR 2 (5.4 Gbps/lane)HDMI 2.0 (6 Gbps/lane)V-By-One HS 1.4 (4 Gbps/lane)MiPi standards |
| Available Pin Count | Signal: 60, 70 |
| Board Pitch | 0.35 mm |
| Contact Pitch | 0.35 mm |
| Depth | 3.64 mm |
| Full EMI Shielding (ZenShield®) | Yes |
| Mechanical Lock | No |
| Product Type | Board-to-Board |
| Width | 3.3 + (0.35 x pin count / 2) mm |
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技术资料
数据手册数据手册 · 3.7 MB · 2026-09-24数据手册数据手册 · 449.4 KB · 2026-09-24模型图档模型图档 · 2.4 MB · 2026-09-24模型图档模型图档 · 2.1 MB · 2026-09-24封装图纸封装图纸 · 2.0 MB · 2026-09-24模型图档模型图档 · 1.7 MB · 2026-09-24模型图档模型图档 · 1.5 MB · 2026-09-24用户手册用户手册 · 865.7 KB · 2026-09-24其他资料其他资料 · 840.1 KB · 2026-09-24选型与目录选型与目录 · 733.9 KB · 2026-09-24封装图纸封装图纸 · 728.6 KB · 2026-09-24封装图纸封装图纸 · 686.8 KB · 2026-09-24封装图纸封装图纸 · 520.2 KB · 2026-09-24封装图纸封装图纸 · 505.7 KB · 2026-09-24环保合规环保合规 · 147.1 KB · 2026-09-24其他资料其他资料 · 107.6 KB · 2026-09-24环保合规环保合规 · 106.9 KB · 2026-09-24
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