全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | SOIC, SSOP |
| Size / Dimension | - |
| 其他 | |
| Board Thickness | - |
| Material | - |
| Mfr | Global Specialties |
| Number of Positions | - |
| Pitch | - |
| Product Status | Obsolete |
| Proto Board Type | SMD to DIP |
| Series | - |
技术资料
该型号暂未收录资料。
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | SOIC, SSOP |
| Size / Dimension | - |
| 其他 | |
| Board Thickness | - |
| Material | - |
| Mfr | Global Specialties |
| Number of Positions | - |
| Pitch | - |
| Product Status | Obsolete |
| Proto Board Type | SMD to DIP |
| Series | - |
该型号暂未收录资料。