FFE-PAGE-46
Futaba Corporation日本

FFE-PAGE-46

在产

Available to adopt mount components of SMT(reflow), discrete(flow) and hand soldering. Both Pb-free and Pb-containing solder are available. Packaging; resin-coating and mold, can be consulted.

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技术参数

ApplicationsHybrid IC, LED module, Power module etc.
FeatureTo be making circuit board by mounting components on ceramic/glass epoxy substrate.
NamePCB mounting
OverviewAvailable to adopt mount components of SMT(reflow), discrete(flow) and hand soldering. Both Pb-free and Pb-containing solder are available. Packaging; resin-coating and mold, can be consulted.

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FFE-PAGE-46实物照片 · 产品库

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