FFE-PAGE-44
在产Thick film printing is to print metal films such as conductor and resistive element on ceramic substrate which makes going into high-temperature baking process for finalization of composite module substrate. This thick film printing technology is applied to our products; resistor network, capacitor array, diode array, LED module and hybrid IC. * Thermal design is available by use of alumina substrate that is good for heat conduction. * Space-saving is achievable to make composite circuit. * Able to assign placement freely and can make any sizes of resistive element on the substrate. * Resistive element that is made by laser triming is guaranteed high accuracy and high reliability. * Available to consult about functional triming for resistive element that is to influence entire circuit function.
全部替代型号
查看完整报告技术参数
| Name | Thick film printing |
| Overview | Thick film printing is to print metal films such as conductor and resistive element on ceramic substrate which makes going into high-temperature baking process for finalization of composite module substrate. This thick film printing technology is applied to our products; resistor network, capacitor array, diode array, LED module and hybrid IC. * Thermal design is available by use of alumina substrate that is good for heat conduction. * Space-saving is achievable to make composite circuit. * Able to assign placement freely and can make any sizes of resistive element on the substrate. * Resistive element that is made by laser triming is guaranteed high accuracy and high reliability. * Available to consult about functional triming for resistive element that is to influence entire circuit function. |
器件图片
技术资料
该型号暂未收录资料。