I-PEX日本
Equipped ZenShield® and multi-point grounds to prevent EMI leakage, EVAFLEX® 5-HD with auto-locking is for high-speed transmission(10+Gbps USB 3.1 Gen2).
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| 电源 | |
|---|---|
| Current Rating | Signal: 0.3 A/pin |
| 环境与封装 | |
| Height | 1.55 +/- 0.2 mm |
| Operating Temperature | -40 to 85℃ (233 to 358 K) |
| 其他 | |
| Applicable Standards (Reference Only) | 【FPC】USB4 (20 Gbps/lane)Thunderbolt3 (20 Gbps/lane)【FFC】USB3.2 Gen2 (10 Gbps/lane)USB3.1 Gen1 (5 Gbps/lane)V-By-One HS 1.4 (4 Gbps/lane) |
| Available Pin Count | Signal: 24 |
| Board Pitch | 0.5 mm |
| Contact Pitch | 0.5 mm |
| Depth | 8.43 mm |
| FFC Type | Shielded |
| FPC / FFC Thickness | Contact Area: 0.3 +/- 0.03 mm, Ground Aea: 0.5 +/- 0.03 mm |
| FPC Type | Shielded |
| Full EMI Shielding (ZenShield®) | Yes |
| Mating Type / Direction | Horizontal |
| Mechanical Lock | Yes |
| Product Type | Auto-Lock |
| Width | 5.2 + (0.5 x pin count) mm |
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数据手册数据手册 · 2.1 MB · 2026-09-24数据手册数据手册 · 215.9 KB · 2026-09-24选型与目录选型与目录 · 2.1 MB · 2026-09-24封装图纸封装图纸 · 1.5 MB · 2026-09-24用户手册用户手册 · 925.9 KB · 2026-09-24模型图档模型图档 · 825.6 KB · 2026-09-24其他资料其他资料 · 707.2 KB · 2026-09-24模型图档模型图档 · 552.7 KB · 2026-09-24封装图纸封装图纸 · 383.5 KB · 2026-09-24封装图纸封装图纸 · 241.3 KB · 2026-09-24环保合规环保合规 · 144.8 KB · 2026-09-24其他资料其他资料 · 105.3 KB · 2026-09-24环保合规环保合规 · 104.6 KB · 2026-09-24模型图档模型图档 · 17.8 KB · 2026-09-24
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