全部替代型号
查看完整报告技术参数
| 电源 | |
|---|---|
| Idle Power | 11 mW typical |
| Power Supply | 3.3V |
| 环境与封装 | |
| Operating Temperature | -40°C to +85°C |
| Package | SOIC |
| 其他 | |
| Data Rate | >100 Mbps (50 MHz) |
| Differential Signaling | ±350 mV |
| Standards | IEEE 1596.3 SCI LVDS, TIA/EIA-644 LVDS |
| 电源 | |
|---|---|
| Idle Power | 11 mW typical |
| Power Supply | 3.3V |
| 环境与封装 | |
| Operating Temperature | -40°C to +85°C |
| Package | SOIC |
| 其他 | |
| Data Rate | >100 Mbps (50 MHz) |
| Differential Signaling | ±350 mV |
| Standards | IEEE 1596.3 SCI LVDS, TIA/EIA-644 LVDS |