Amphenol美国

DIP324-014BLF

停产IC 插座

CONN IC DIP SOCKET 24POS TIN

查看国产替代问 AI FAE
间距2.54 mm

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技术参数

间距2.54 mm
环境与封装
Mounting TypeThrough Hole
Operating Temperature-
PackageBag
其他
Base Product NumberDIP324
Contact Finish - MatingTin
Contact Finish - PostTin
Contact Finish Thickness - Mating100.0µin (2.54µm)
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
Contact Resistance-
FeaturesOpen Frame
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Material Flammability RatingUL94 V-0
MfrAmphenol ICC (FCI)
Number of Positions or Pins (Grid)24 (2 x 12)
Pitch - Mating0.100" (2.54mm)
Pitch - Post0.100" (2.54mm)
Product StatusObsolete
Series-
TerminationSolder
Termination Post Length0.125" (3.18mm)
TypeDIP, 0.3" (7.62mm) Row Spacing

技术资料

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