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间距2.54 mm
| 环境与封装 | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | - |
| Package | Bag |
| 其他 | |
| Base Product Number | DIP314 |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Contact Resistance | - |
| Features | Open Frame |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mfr | Amphenol ICC (FCI) |
| Number of Positions or Pins (Grid) | 14 (2 x 7) |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Product Status | Obsolete |
| Series | - |
| Termination | Solder |
| Termination Post Length | 0.125" (3.18mm) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
技术资料
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