全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Package | Bulk |
| Package Accepted | SOIC |
| Size / Dimension | 6.000" L x 4.000" W (152.40mm x 101.60mm) |
| 其他 | |
| Base Product Number | 8100 |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | - |
| Mfr | Twin Industries |
| Number of Positions | - |
| Pitch | 0.020" (0.50mm) |
| Product Status | Active |
| Proto Board Type | SMD to Plated Through Hole Board |
| Series | - |
器件图片
技术资料
该型号暂未收录资料。