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| 环境与封装 | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 59°F~86°F(15°C~30°C) |
| 其他 | |
| Composition | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
| Diameter | 0.022" (0.56mm) |
| Flux Type | No-Clean |
| Form | Spool, 8.8 oz (250g) |
| Melting Point | 423°F (217°C) |
| Mfr | Harimatec Inc. |
| Process | Lead Free |
| Product Status | Obsolete |
| Series | C400 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Wire Gauge | 23 AWG, 24 SWG |