BOARD LEVEL HEATSINK .375"TO-220
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| 环境与封装 | |
|---|---|
| Fin Height | 0.375" (9.52mm) |
| Package | Bulk |
| Package Cooled | TO-220 |
| Power Dissipation @ Temperature Rise | 1.5W@50°C |
| Thermal Resistance @ Forced Air Flow | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 25.80°C/W |
| 其他 | |
| Attachment Method | Bolt On and PC Pin |
| Base Product Number | 7173 |
| Diameter | - |
| Length | 0.750" (19.05mm) |
| Material | Copper |
| Material Finish | Tin |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Product Status | Active |
| Series | - |
| Shape | Rectangular, Fins |
| Type | Board Level, Vertical |
| Width | 0.750" (19.05mm) |