BOARD LEVEL HEAT SINK
全部替代型号
查看完整报告技术参数
| 环境与封装 | |
|---|---|
| Fin Height | 0.401" (10.20mm) |
| Package | Bulk |
| Package Cooled | TO-268 (D³Pak) |
| Power Dissipation @ Temperature Rise | 1.0W@20°C |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 600 LFM |
| Thermal Resistance @ Natural | 14.00°C/W |
| 其他 | |
| Attachment Method | SMD Pad |
| Base Product Number | 573400 |
| Diameter | - |
| Length | 0.500" (12.70mm) |
| Material | - |
| Material Finish | Tin |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Product Status | Active |
| Series | - |
| Shape | Rectangular, Fins |
| Type | Top Mount |
| Width | 1.220" (30.99mm) |