Molex美国

CONN RCPT 4POS SMD GOLD

问 AI FAE
针数8
排数2
间距400 µm
公母母

全部替代型号

查看完整报告

技术参数

针数8
排数2
间距400 µm
公母母
环境与封装
Height Above Board0.030" (0.75mm)
Mated Stacking Heights0.8mm
Mounting TypeSurface Mount
PackageTape & Reel (TR) Cut Tape (CT) Digi-Reel®
其他
Base Product Number505004
Connector TypeReceptacle, Center Strip Contacts
Contact FinishGold
Contact Finish Thickness-
FeaturesPick and Place, Solder Retention
MfrMolex
Number of Positions8 (4 + 4 Power)
Number of Rows2
Pitch0.016" (0.40mm)
Product StatusActive
SeriesSlimStack 505004

技术资料

该型号暂未收录资料。