Molex美国

CONN RCPT 30POS SMD GOLD

针数30
排数2
间距400 µm
公母母

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技术参数

针数30
排数2
间距400 µm
公母母
环境与封装
Height Above Board0.048" (1.22mm)
Mated Stacking Heights1.3mm
Mounting TypeSurface Mount
PackageTape & Reel (TR)
其他
Base Product Number501527
Connector TypeReceptacle, Center Strip Contacts
Contact FinishGold
Contact Finish Thickness8.00µin (0.203µm)
FeaturesSolder Retention
MfrMolex
Number of Positions30
Number of Rows2
Pitch0.016" (0.40mm)
Product StatusObsolete
SeriesSlimStack 501527

技术资料