针数30
排数2
间距500 µm
公母公
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技术参数
针数30
排数2
间距500 µm
公母公
| 环境与封装 | |
|---|---|
| Height Above Board | 0.058" (1.48mm) |
| Mated Stacking Heights | 2.5mm |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR) |
| 其他 | |
| Base Product Number | 500334 |
| Connector Type | Plug, Outer Shroud Contacts |
| Contact Finish | Gold |
| Contact Finish Thickness | 10.0µin (0.25µm) |
| Features | - |
| Mfr | Molex |
| Number of Positions | 30 |
| Number of Rows | 2 |
| Pitch | 0.020" (0.50mm) |
| Product Status | Obsolete |
| Series | SlimStack 500334 |