Serpac美国

BREADBRD PREPUNCHED INSULAT NPTH

问 AI FAE数据手册 PDF

全部替代型号

查看完整报告

技术参数

环境与封装
PackageBulk
Size / Dimension2.92" L x 2.88" W (74.2mm x 73.2mm)
其他
Board Thickness0.062" (1.58mm)
Circuit Pattern-
Edge Contacts-
Hole Diameter0.038" (0.97mm)
MaterialFR4 Epoxy Glass
MfrSerpac
Pitch0.100" (2.54mm)
PlatingNon-Plated Through Hole (NPTH)
Product StatusObsolete
Proto Board TypeBreadboard, Prepunched Insulating
Series-

技术资料