397952

在产焊料

HMP 366 3% .022DIA. 23AWG

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技术参数

环境与封装
PackageBulk
Storage/Refrigeration Temperature-
其他
CompositionPb93.5Sn5Ag1.5 (93.5/5/1.5)
Diameter0.022" (0.56mm)
Digi-Key Storage-
Flux TypeRosin Activated (RA)
FormSpool, 8.8 oz (250g)
Melting Point565 ~ 574°F (296 ~ 301°C)
MfrHarimatec Inc.
ProcessLeaded
Product StatusActive
Series366
Shelf Life-
Shelf Life Start-
Shipping Info-
TypeWire Solder
Weight0.551 lb (249.93 g)
Wire Gauge23 AWG, 24 SWG

技术资料

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