HEATSINK BGA W/ADHESIVE TAPE
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| 环境与封装 | |
|---|---|
| Fin Height | 0.709" (18.00mm) |
| Package | Bulk |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 2.0W@30°C |
| Thermal Resistance @ Forced Air Flow | 4.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 12.00°C/W |
| 其他 | |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | 375024 |
| Diameter | - |
| Length | 1.575" (40.00mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Product Status | Active |
| Series | - |
| Shape | Square, Pin Fins |
| Shelf Life | - |
| Type | Top Mount |
| Width | 1.575" (40.01mm) |