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技术参数

环境与封装
Fin Height-
PackageBulk
Package Cooled-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
其他
Attachment Method-
Diameter-
Length-
Material-
Material Finish-
MfrAavid, Thermal Division of Boyd Corporation
Product StatusActive
Series-
Shape-
Type-
Width-

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