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| 环境与封装 | |
|---|---|
| Mounting Feature | Standard |
| Mounting Type | Through Hole |
| Package | Box |
| 其他 | |
| Connector Style | DIMM |
| Contact Finish | Gold |
| Contact Finish Thickness | 3.00µin (0.076µm) |
| Features | Board Lock, Latches |
| Memory Type | DDR3 SDRAM |
| Mfr | TE Connectivity AMP Connectors |
| Number of Positions | 240 |
| Product Status | Active |
| Series | - |
| Standards | MO-269 |
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