122114

122114

在产

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技术参数

交流 / 直流特性
Operating frequency902 ... 928 MHz
环境与封装
Ambient temperature-40 ... 85 °C (-40 ... 185 °F)
Directive 2011/65/EU (RoHS)IEC/EN 63000
Directive 2011/65/EU (RoHS) IEC/EN 63000Directive 2011/65/EU (RoHS) | IEC/EN 63000
Height7.5 mm
Height 7.5 mm Width 36.2 mm Length 55 mmHeight | 7.5 mm | Width | 36.2 mm | Length | 55 mm
Storage temperature-40 ... 250 °C (-40 ... 482 °F) 250 °C for 500 hours
其他
Chip TypeHiggs-9 (Alien)
Construction typeRectangular type
Data retention period50 years
Degree of protectionEN 60529
Directive 2014/53/EUEN 302208
Directive 2014/53/EU EN 302208Directive 2014/53/EU | EN 302208
HousingPolymer , 316L Stainless steel , silicone free
Housing Polymer , 316L Stainless steel , silicone freeHousing | Polymer , 316L Stainless steel , silicone free
Length55 mm
Mass26 g
Memory Bank 00 (Reserved)64 Bit
Memory Bank 01 (EPC/UII)96 ... 496 Bit
Memory Bank 10 (TID)48 Bit
Memory Bank 11 (User memory)688 Bit
NotePackaging unit, 10-piece
On metalyes
On metal yesOn metal | yes
Polarizationlinear
Read cyclesunlimited
RFIDISO/IEC 18000-63
Shock and impact resistance1 m (3 ft) on concrete
Width36.2 mm
Write cycles200000

器件图片

技术资料

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