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技术参数

环境与封装
Package AcceptedSOIC, TSSOP
Size / Dimension1.400" L x 0.700" W (35.56mm x 17.78mm)
其他
Board Thickness-
ManufacturerAdafruit Industries LLC
Material-
Number of Positions28
PackagingBulk
Part StatusActive
Pitch-
Proto Board TypeSMD to DIP
Series-

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技术资料