间距800 µm
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间距800 µm
| 环境与封装 | |
|---|---|
| Package | Bag |
| 其他 | |
| Mfr | Ironwood Electronics |
| Number of Positions or Pins (Grid) | 96 (9 x 16) |
| Pitch - Mating | 0.031" (0.80mm) |
| Product Status | Active |
| Series | Grypper |
| Termination | Solder |
| Type | BGA |
| 环境与封装 | |
|---|---|
| Package | Bag |
| 其他 | |
| Mfr | Ironwood Electronics |
| Number of Positions or Pins (Grid) | 96 (9 x 16) |
| Pitch - Mating | 0.031" (0.80mm) |
| Product Status | Active |
| Series | Grypper |
| Termination | Solder |
| Type | BGA |