间距800 µm
全部替代型号
查看完整报告技术参数
间距800 µm
| 环境与封装 | |
|---|---|
| Package | Bag |
| 其他 | |
| Mfr | Ironwood Electronics |
| Number of Positions or Pins (Grid) | 78 (6 x 13) |
| Pitch - Mating | 0.031" (0.80mm) |
| Product Status | Active |
| Series | Grypper |
| Termination | Solder |
| Type | BGA |
技术资料
该型号暂未收录资料。
| 环境与封装 | |
|---|---|
| Package | Bag |
| 其他 | |
| Mfr | Ironwood Electronics |
| Number of Positions or Pins (Grid) | 78 (6 x 13) |
| Pitch - Mating | 0.031" (0.80mm) |
| Product Status | Active |
| Series | Grypper |
| Termination | Solder |
| Type | BGA |
该型号暂未收录资料。