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| 环境与封装 | |
|---|---|
| Package | 6L DFN |
| Package (mm) | 3x3 |
| 其他 | |
| Conv Loss (dB) | 6.5–7.5 |
| Description | Low Conversion Loss |
| ECCN | EAR99 |
| ESD HBM (V) | 100 |
| IIP3 (dBm) | 32 |
| Max Freq. | 6 GHz |
| Max LO Drive (dBm) | 20 |
| Min Freq. | DC |
| PCN/EOL | PCN – January 16, 2018: Wafer Fabrication Process, Ordering Code |
| Typ. Iso (dB) LO-IF | 25–40 |
| Typ. Iso (dB) LO-RF | 25–40 |