针数40
排数2
间距2.54 mm
公母母
全部替代型号
查看完整报告技术参数
针数40
排数2
间距2.54 mm
公母母
额定电流4.1 A最大
| 电源 | |
|---|---|
| Current Rating (Amps) | 4.1A per Contact |
| Voltage Rating | 400VAC |
| 环境与封装 | |
| Insulation Height | 0.144" (3.66mm) |
| Mated Stacking Heights | - |
| Mounting Type | Surface Mount |
| Operating Temperature | -55°C ~ 125°C |
| 其他 | |
| Applications | - |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Finish Thickness - Post | - |
| Contact Length - Post | - |
| Contact Material | Beryllium Copper |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Features | Board Guide, Pick and Place |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | - |
| Mfr | Samtec Inc. |
| Number of Positions | 40 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Packaging | Tube |
| Part Status | Active |
| Pitch - Mating | 0.100" (2.54mm) |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Series | HLE |
| Style | Board to Board |
| Termination | Solder |