DF40B-30DS-0.4V
阵列、边缘型、夹层式（板对板）IC BOARD-TO-BOARD CONN 30POS 0.4MM SMT
针数30
间距400 µm
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针数30
间距400 µm
| 电源 | |
|---|---|
| Rated Current | 0.3 A |
| Rated Voltage | AC, DC 30 V |
| 环境与封装 | |
| Operating Temperature | -35 to +85°C |
| Stacking Height | 1.5 mm |
| 其他 | |
| Contact Resistance | 90 mΩ (Max) |
| Insulation Resistance | 50 MΩ (Min) |
| Mating Cycles | 30 |
| Number of Positions | 30 |
| Pitch | 0.4 mm |
| Termination | SMT |