SHIFT REG 8-BIT 3-STATE 2V-6V 16-SOIC
8位串行输入并行输出移位寄存器，带三态输出锁存器，工作电压2V-6V，最高频率30MHz，提供SOIC、SOP、TSSOP及PDIP封装。规格书核对
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18 项| 参数 | 值和测试条件 | 出处 |
|---|---|---|
| 封装 | 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150'' Narrow; 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300'' Wide; 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide; 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide; 16-L | |
| 工作温度 | Min: -40°C, Max: +85°C | |
| 推荐工作电压 | Min: 2V, Max: 6V | |
| 绝对最大额定电压 | -0.5V to +7.0V | |
| 存储温度 | -65°C to +150°C | |
| 静态电流 | Max: 80 µA (VCC=6.0V, TA=-40 to 85°C) |
全部参数（6 项）
| 电源 | |
|---|---|
| DC Output Current, per pin (IOUT) | ±35 mA |
| Maximum Quiescent Supply Current (ICC) | 80 µA (Max) |
| Supply Voltage (VCC) | 2 V (Min) to 6 V (Max) |
| 交流 / 直流特性 | |
| Maximum Operating Frequency of SCK | 30 MHz (Max) |
| 环境与封装 | |
| Operating Temperature Range (TA) | -40 °C (Min) to +85 °C (Max) |
| Package Description | 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 |
引脚与封装
Connection Diagram
| 脚位 | 名称 | 功能 | 出处 |
|---|---|---|---|
| 1 | VCC | (电源正极) | |
| 2 | QA | (并行输出A) | |
| 3 | QB | (并行输出B) | |
| 4 | QC | (并行输出C) | |
| 5 | QD | (并行输出D) | |
| 6 | QE | (并行输出E) | |
| 7 | QF | (并行输出F) | |
| 8 | QG | (并行输出G) | |
| 9 | QH | (并行输出H) | |
| 10 | GND | (电源地) | |
| 11 | SCLR | (移位寄存器清零，低电平有效) | |
| 12 | SCK | (移位时钟) | |
| 13 | RCK | (存储寄存器时钟) | |
| 14 | SER | (串行数据输入) | |
| 15 | QH' (串行输出，用于级联) | ||
| 16 | G | (输出使能，低电平有效) |
器件图片
技术资料
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