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| 环境与封装 | |
|---|---|
| Fin Height | 0.450" (11.43mm) |
| Package | Bag |
| Package Cooled | TO-263 (D²Pak) |
| Power Dissipation @ Temperature Rise | 2.0W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 3.00°C/W @ 300 LFM |
| Thermal Resistance @ Natural | 11.00°C/W |
| 其他 | |
| Attachment Method | SMD Pad |
| Base Product Number | 7109 |
| Diameter | - |
| Length | 0.763" (19.38mm) |
| Material | Copper |
| Material Finish | Tin |
| Mfr | Boyd Laconia, LLC |
| Product Status | Active |
| Series | - |
| Shape | Rectangular, Fins |
| Type | Top Mount |
| Width | 1.000" (25.40mm) |