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| 环境与封装 | |
|---|---|
| Package | Jar |
| Storage/Refrigeration Temperature | - |
| 其他 | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Flux Type | - |
| Form | Jar, 17.64 oz (500g) |
| Melting Point | 423 ~ 424°F (217 ~ 218°C) |
| Mesh Type | - |
| Mfr | Kester Solder |
| Process | Lead Free |
| Product Status | Obsolete |
| Series | - |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Type | Solder Paste |
| Weight | 1.1 lbs (499 g) |
| Wire Gauge | - |
技术资料
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