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技术参数

环境与封装
PackageBulk
Package Accepted-
Size / Dimension1.500" L x 1.400" W (38.10mm x 35.56mm)
其他
Board Thickness0.100" (2.54mm) 1/10"
Material-
MfrAdafruit Industries LLC
Number of Positions7
Pitch-
Product StatusActive
Proto Board TypePlated Through Hole to Plated Through Hole
Series-

技术资料

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