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| 环境与封装 | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| 其他 | |
| Composition | Sn50Pb48.5Cu1.5 (50/48.5/1.5) |
| Diameter | 0.032" (0.81mm) |
| Digi-Key Storage | - |
| Flux Type | Rosin Activated (RA) |
| Form | Spool, 17.64 oz (500g) |
| Melting Point | 361 ~ 420°F (183 ~ 216°C) |
| Mfr | Harimatec Inc. |
| Process | Leaded |
| Product Status | Obsolete |
| Series | 366 |
| Shelf Life | - |
| Shelf Life Start | - |
| Shipping Info | - |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 21 SWG |