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技术参数

环境与封装
Package Accepted-
Size / Dimension2.827" L x 0.496" W (71.80mm x 12.60mm)
其他
Board Thickness-
ManufacturerPhoenix Contact
Material-
Number of Positions-
PackagingBulk
Part StatusActive
Pitch0.197" (5.00mm)
Proto Board TypePlated Through Hole to Plated Through Hole
Series-

技术资料