间距2.54 mm
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间距2.54 mm
| 环境与封装 | |
|---|---|
| Mounting Type | Through Hole |
| Operating Temperature | - |
| Package | Tray |
| 其他 | |
| Base Product Number | 5916783 |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Mating | Copper Alloy |
| Contact Material - Post | Copper Alloy |
| Contact Resistance | - |
| Features | Open Frame |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mfr | TE Connectivity AMP Connectors |
| Number of Positions or Pins (Grid) | 370 (19 x 19) |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Product Status | Obsolete |
| Series | - |
| Termination | Solder |
| Termination Post Length | 0.093" (2.36mm) |
| Type | PGA, ZIF (ZIP) |
技术资料
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