133254

133254

在产

Industrial Box Thin Client

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技术参数

电源
Power supplyInput voltage: 12 ... 28 V DC Input current: 4.6 A … 1.9 A Input via 2.5 mm power socket
环境与封装
Dimensions259.1 mm x 56.05 mm x 199.8 mm
Directive 2011/65/EU (RoHS)EN IEC 63000:2018-12
Directive 2011/65/EU (RoHS) EN IEC 63000:2018-12Directive 2011/65/EU (RoHS) | EN IEC 63000:2018-12
MountingDesktop or wall mounting, VESA mount (100 x 100 mm and 75 x 75 mm) and DIN-rail mounting via optional adapter
Operating temperature0 ... 55 °C (32 ... 131 °F)
Storage temperature-20 ... 60 °C (-4 ... 140 °F)
其他
Approved forCE (EN61326-1/ EN55032/ EN55035 Class A) FCC Class A and ICES-003 Issue 7
Degree of protectionIP4x
Directive 2014/30/EUEN 61326-1:2021 EN 55032:2015+A11:2020+A1: 2020 EN 55011:2016+A1:2017+A11:2020+A2:2021 (Group 1, Class B)
Directive 2014/30/EU EN 61326-1:2021 EN 55032:2015+A11:2020+A1: 2020 EN 55011:2016+A1:2017+A11:2020+A2:2021 (Group 1, Class B)Directive 2014/30/EU | EN 61326-1:2021 EN 55032:2015+A11:2020+A1: 2020 EN 55011:2016+A1:2017+A11:2020+A2:2021 (Group 1, Class B)
Interface typeFront side: 1x USB 3.2 Gen 1 Type C 2x USB 2.0 Type A, Power button, Audio line out Back side: 3x 1000Base-T Ethernet, 4x DisplayPort 1.4, 1x DC (DC jack 5.5 x 2.5 mm with lock mechanism), 3x USB 3.2 Gen 1 Type A, 1x RS-232/RS-485 with RJ45 connector
Mass2.47 kg
Mass storage64 GByte M.2 SSD
Notepassive cooling , no moving parts Power supply not included.
Operating system2-: VisuNet RM Shell 6 (based on Windows® 11 IoT Enterprise LTSC 2024) Optional: J-: IGEL OS 12 (based on Linux, pre-installed without licence) T-: ThinManager Ready
ProcessorAMD Ryzen R2314
RAM8 GB DDR4 (2x 4 GByte dual-channel RAM)
Relative humidity≤ 90 % at 60 °C (non-condensing acc. to EN 60068-2-78)
Shock resistance40 g (11 ms) when operating 80 g (11 ms) when not operating
UL approval"UL Listed" for Canada and USA, E223772 (Ordinary Location)
Vibration resistance3 g rms 5 ... 500 Hz

器件图片

技术资料

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